Détail de l'actualité

EdgeQ completed a $75 million Series B funding round

20/04/2023

EdgeQ, a semiconductor startup specializing in building 5G wireless communications chips, announced today that it has completed a Series B funding round of $75 million. The funding round was led by Koch Disruptive Technologies (KDT), with participation from new investors GV and Deutsche Telekom Capital Partners (DTCP), as well as existing investors Fusion Fund, Threshold Ventures, and Wing Venture Capital.

The company plans to use the funds to accelerate the development and commercialization of its innovative technology, which combines artificial intelligence and 5G wireless networking capabilities on a single chip. This technology is designed to make it easier and more cost-effective for businesses and consumers to access high-speed 5G networks, enabling faster downloads, smoother streaming, and better connectivity for Internet of Things (IoT) devices.

EdgeQ's unique approach to integrating AI and 5G on a single chip has attracted significant interest from investors, as well as potential customers across a range of industries. With this latest funding round, the company is well-positioned to expand its operations and bring its products to market, helping to drive the next wave of innovation in wireless networking and IoT technologies.

"We are thrilled to have the support of such a distinguished group of investors as we continue to build out our platform and bring our technology to market," said EdgeQ CEO Vinay Ravuri. "This funding will allow us to accelerate our growth and deliver on our vision of empowering businesses and consumers with seamless, intelligent connectivity."

Overall, EdgeQ's successful funding round represents a major milestone for the company and underscores the growing demand for advanced wireless networking solutions that can support an increasingly connected world. As the company continues to develop and refine its technology, it is poised to play a significant role in shaping the future of wireless communications and IoT.

EdgeQ

Mots clés

Nouvelles croisées

1. Chinese 5G Networks: Pervasive Coverage and Integr...

Chinese 5G Networks: Pervasive Coverage and Integration into Various Industries

2. TSMC's Yield Improvement and Production Timeline i...

TSMC's Yield Improvement and Production Timeline in Arizona

3. Macom acquires Wolfspeed's RF division

Macom acquires Wolfspeed's RF division

4. Why bltouch failed to verify sensor state

Why bltouch failed to verify sensor state

5. Introducing Arduino Uno R4: Evolution with 32-bit ...

Introducing Arduino Uno R4: Evolution with 32-bit Power

6. STMicroelectronics STM32F030F4P6

STMicroelectronics STM32F030F4P6

7. Flex PCBA: The Key to Agile Electronics Manufacturing

Flex PCBA: The Key to Agile Electronics Manufacturing

8. ispace Collaborates with Swedish Space Corporation...

ispace Collaborates with Swedish Space Corporation for Mission 3

9. PCBA Manufacturing: Assembly Service

PCBA Manufacturing: Assembly Service

10. IENAI Secures €4 Million Funding for Space Electro...

IENAI Secures €4 Million Funding for Space Electrospray Thruster System Development