Détail de l'actualité

Ericsson has announced its partnership with Intel

27/07/2023

Ericsson has announced its partnership with Intel for the production of 5G System-on-Chips (SoCs) using Intel's 18A process. Fredrik Jejdling, executive vice president and head of Networks at Ericsson, expressed excitement about expanding their collaboration with Intel, stating, "Ericsson has a long history of close collaboration with Intel, and we are pleased to expand this further as we utilize Intel to manufacture our future custom 5G SoCs on their 18A process node." Jejdling also emphasized their commitment to accelerating industry-scale open RAN by leveraging standard Intel Xeon-based platforms.  

Intel has revealed that its 18A process is expected to be "manufacturing ready" in the second half of 2024. The company believes that this process will position them as leaders in the industry by 2025, enhancing the offerings of their customers in the market. Sachin Katti, Senior Vice President at Intel, described the partnership with Ericsson as a significant milestone and emphasized their broad collaboration in developing next-generation optimized 5G infrastructure.

Ericsson

Mots clés

Nouvelles croisées

1. NASA Introduces New Moon Rovers

NASA Introduces New Moon Rovers

2. Double Diode Pricing: How to Get the Best Deals an...

Double Diode Pricing: How to Get the Best Deals and Savings

3. Which electronic components are used in second gen...

Which electronic components are used in second generation computers?

4. SR626SW Battery: Everything You Need to Know

SR626SW Battery: Everything You Need to Know

5. WT Microelectronics acquires Future Electronics fo...

WT Microelectronics acquires Future Electronics for $3.8 billion.

6. Semiconductor Device Fabrication

Semiconductor Device Fabrication

7. High Volume PCB Assembly Service by Chips Pulse

High Volume PCB Assembly Service by Chips Pulse

8. Embedded World 2024: The Latest Trends and Innovat...

Embedded World 2024: The Latest Trends and Innovations in Embedded Systems

9. Pickering Electronics has introduced a series of s...

Pickering Electronics has introduced a series of surface-mount >1kV reed relays

10. IBM and ASYMPT Introduce Revolutionary Hybrid Bond...

IBM and ASYMPT Introduce Revolutionary Hybrid Bonding Method for Chiplet