Weebit Nano Successfully Qualifies ReRAM Module for Operation at 125 Degrees Celsius

Weebit Nano has successfully qualified its ReRAM module for use in automotive grade 1 NVMs, meeting the temperature requirement of up to 125 degrees Celsius. This achievement demonstrates the applicability of Weebit's ReRAM technology in automotive components, MCUs, high-temperature industrial applications, and IoT devices. The qualification process followed well-established JEDEC industry standards for NVMs and involved testing multiple silicon dies from different wafer lots. While consumer and industrial chips typically undergo qualification for 10 years at temperatures ranging from zero to 85 degrees Celsius, advanced automotive components require more stringent testing at higher temperatures over a longer period without any failures. Weebit's ReRAM modules successfully passed the 125 degrees Celsius qualification test for 10 years of retention.

Coby Hanoch, the CEO of Weebit Nano, expressed that this accomplishment is part of an ongoing effort to further expand the qualification of their ReRAM technology to even higher temperatures, longer retention periods, and increased endurance levels. The company has observed growing interest in their ReRAM technology from Tier-1 foundries and semiconductor companies for automotive and industrial applications. The resilience of Weebit's ReRAM modules at high temperatures strengthens these discussions. Compared to other emerging NVM technologies, Weebit believes that ReRAM is a superior choice for automotive and industrial applications due to its exceptional performance at high temperatures, low complexity, cost-effectiveness, and additional advantages such as radiation and electromagnetic interference tolerance.

The Weebit ReRAM demo chip incorporates a complete sub-system designed for embedded applications. It consists of the Weebit ReRAM module, a RISC-V microcontroller (MCU), system interfaces, memories, and peripherals. The ReRAM module features a 128Kb 1T1R ReRAM array along with control logic, decoders, IOs (Input/Output communication elements), and error correcting code (ECC). The module incorporates unique patent-pending analog and digital circuitry that employs intelligent algorithms to significantly enhance the memory array's technical parameters.