EdgeQ completed a $75 million Series B funding round

EdgeQ, a semiconductor startup specializing in building 5G wireless communications chips, announced today that it has completed a Series B funding round of $75 million. The funding round was led by Koch Disruptive Technologies (KDT), with participation from new investors GV and Deutsche Telekom Capital Partners (DTCP), as well as existing investors Fusion Fund, Threshold Ventures, and Wing Venture Capital.

The company plans to use the funds to accelerate the development and commercialization of its innovative technology, which combines artificial intelligence and 5G wireless networking capabilities on a single chip. This technology is designed to make it easier and more cost-effective for businesses and consumers to access high-speed 5G networks, enabling faster downloads, smoother streaming, and better connectivity for Internet of Things (IoT) devices.

EdgeQ's unique approach to integrating AI and 5G on a single chip has attracted significant interest from investors, as well as potential customers across a range of industries. With this latest funding round, the company is well-positioned to expand its operations and bring its products to market, helping to drive the next wave of innovation in wireless networking and IoT technologies.

"We are thrilled to have the support of such a distinguished group of investors as we continue to build out our platform and bring our technology to market," said EdgeQ CEO Vinay Ravuri. "This funding will allow us to accelerate our growth and deliver on our vision of empowering businesses and consumers with seamless, intelligent connectivity."

Overall, EdgeQ's successful funding round represents a major milestone for the company and underscores the growing demand for advanced wireless networking solutions that can support an increasingly connected world. As the company continues to develop and refine its technology, it is poised to play a significant role in shaping the future of wireless communications and IoT.